Advantages:
1. High uniformity, excellent pore/sidewall coverage, and strong adhesion of deposited film.
2. To reduce the risk of thermal damage to the substrate, low-temperature process control is applied in the sputtering system.
3. With the ability to use different target materials for deposition on substrates like ABF, EMC, and PID, our sputter provides a wide scope of processing options.
4. Inline sputtering system provides high throughput and large-sized suitability.
5. Our sputter system offers custom chamber configurations to satisfy particular production needs.
Parameter | Details |
Substrate Material | Si wafer, ceramic, glass, ABF, EMC, PID, etc. |
Target Material | Metal, oxide, silicide, etc. |
Uniformity | ±5% |
Vacuum Level | 10-7Torr |
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