Advantages：
1. Compatible with a range of workpiece sizes (50-100mm wide, 160-300mm long).
2. High precision, speed, and stability in marking that meets high-quality continuous through put.
3. Self-developed software and hardware, ensuring smooth operation and ease of maintenance.
4. User-friendly interface with processing reports, alarm signals, and solution prompts.
5. Fully automated for high efficiency and supports product traceability in the semiconductor industry.
| Parameter | Details |
| Dimensions | 3200*1330*1810mm（L*W*H） |
| Load and Unload | Slot to Slot, capacity for 3 magazines |
| Workpiece size | W: 50-100mm, L: 160-300mm，Warpage: ≤5mm |
| Feeding Track | Track size range 50-100mm (Auto-adjustable) |
| Orientation | CCD camera |
| ESD and Dust collection | Ion fan + brush + vacuum exhaust |
| Laser Module | Optional (TEYAN TLF / TLG series) |
| 2D Reader | Identify the strip ID |
| Dust Collection in Marking Box | vacuum exhaustor |
| Post-Vision Inspection | Bin map，content, location |
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