全自动晶圆等离子刻蚀系统

全自动晶圆等离子刻蚀系统

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Advantages:

1. High-performance plasma system ensures etching and activation uniformity.

2. Capable of handling 6'', 8'', and 12'' wafers, meeting a variety of production needs.

3. Guarantees uniform treatment and supports fully automated handling.

4. Equipped with high-precision dual-arm wafer robots for precise wafer positioning, reducing the risk of wafer damage.

5. With our integrated control system, we simplify operations, lower the entry threshold, and boost efficiency.




Specifications

Specifications

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ParameterDetails
Dimensions1900*1550*2100mm(L*W*H)
Chamber AccessSide-Opening vacuum chamber for robotic manipulation
Wafer Compatibility6”/8”/12” ,thickness ≥200um, Warpage ≤1mm
RF Generator1000W, 13.56MHz
Process GasO2,Ar,N2,CF4(spare)
Gas InletTop inlet
MFC0-300sccm
Vacuum PumpDry pump
Vacuum Level0.02Torr


Plasma descum
智能技术
Applications

Applications

Wafer Bumping前工序除胶;增强晶圆附着力;去除金属氧化物;晶圆表面预处理Plasm

传真Fax/电话Tel: (+86) 0755-23216715
地址 : 深圳市光明区玉塘街道田寮社区田寮路智衍创新大厦1栋4层
Add: 4/F, Building 1, Zhiyan Innovation Building, Tianliao Road, Tianliao Community, Yutang Street, Guangming District, Shenzhen