Advantages:
1. High-performance plasma system ensures etching and activation uniformity.
2. Capable of handling 6'', 8'', and 12'' wafers, meeting a variety of production needs.
3. Guarantees uniform treatment and supports fully automated handling.
4. Equipped with high-precision dual-arm wafer robots for precise wafer positioning, reducing the risk of wafer damage.
5. With our integrated control system, we simplify operations, lower the entry threshold, and boost efficiency.
Parameter | Details |
Dimensions | 1900*1550*2100mm(L*W*H) |
Chamber Access | Side-Opening vacuum chamber for robotic manipulation |
Wafer Compatibility | 6”/8”/12” ,thickness ≥200um, Warpage ≤1mm |
RF Generator | 1000W, 13.56MHz |
Process Gas | O2,Ar,N2,CF4(spare) |
Gas Inlet | Top inlet |
MFC | 0-300sccm |
Vacuum Pump | Dry pump |
Vacuum Level | 0.02Torr |
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