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先进封装
Issuing time:2022-07-27 15:00
处于前沿的封装形式和技术。目前,带有倒装芯片(FC)结构封装、晶圆级封装(WLP)、系统级封装(SiP)、硅通孔技术(TSV)、2.5D 封装、3D 封装等均被认为属于先进封装范畴。
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