English
English
¦
中文
Home
Home
About Us
Nav
Equipment Introduction
Nav
Advanced Packaging
Nav
Careers
Nav
Contact Us
Nav
Auto Wafer Plasma Etching Equipment
Nav
In-line Plasma Cleaning Equipment
Nav
先进封装
Issuing time:2022-07-27 15:00
处于前沿的封装形式和技术。目前，带有倒装芯片（FC）结构封装、晶圆级封装（WLP）、系统级封装（SiP）、硅通孔技术（TSV）、2.5D 封装、3D 封装等均被认为属于先进封装范畴。
Prev
2.5D 封装
Next
封装
传真Fax/电话Tel: (+86) 0755-23216715
地址 : 深圳市光明区玉塘街道田寮社区田寮路智衍创新大厦1栋4层
Add: 4/F, Building 1, Zhiyan Innovation Building, Tianliao Road, Tianliao
Community, Yutang Street, Guangming District, Shenzhen
