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前段(FEOL)后段(BEOL)
Issuing time:2022-07-27 15:05
前段(FEOL)指对芯片有源部分的制造工序,即位于芯片硅衬底上的晶体管;后段(BEOL)指在晶体管上部建立若干层的导电金属线,不同层金属线之间由柱状金属相连的制造。
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